About Us

In late 2008, Chuck Byer and Tim Lemke joined forces and founded Z-Plane, Inc., to develop and provide new packaging technologies for high-speed telecommunications and computing equipment.  Current key management personnel include: 


Charles C. Byer (President, CEO) -  Mr. Byer (MBA, BSEE) is an experienced and proven business executive with 30 years of new product, new business and new market development experience, largely in the electronics and instrumentation industries.  Chuck is a specialist in new business development as well as design and engineering firm management. His managerial background includes:

  • President & CEO, PCT LLC, a business development consulting firm
  • Executive VP & COO, Pacific Consultants LLC, an electronics product design     and engineering firm (acquired)
  • Pacific Consultants ranked 134/500 in the INC500, 2001
  • President and CEO, Power Spectra, Inc., a publicly held semiconductor and military electronics product manufacturer
  • President and CEO, Beta Phase, Inc., a publicly held high-speed, flex-circuit based, electronic connector company (acquired)
  • Multiple management capacities at the DuPont Company, including marketing, engineering and manufacturing, largely in the Berg Electronics and Scientific and Process Instruments Divisions

Mr. Byer holds and an MBA from the Wharton School, University of Pennsylvania and a BSEE from The Pennsylvania State University.



Timothy A. Lemke (Vice President, CDO) -  Mr. Lemke has more than 30 years of experience in electronic interconnection and packaging technology in a variety of capacities, primarily as a design engineer.  Tim has worked in this capacity for major connector companies such as, AMP, Burndy, and DuPont (Berg Electronics, which was purchased by FCI).  He started his own company, Broadside Technology LLC, and has consulted with several major connector companies worldwide.  Tim has authored a large number of technical publications and has been involved in a number of innovative, award winning, high-speed electronic interconnect product designs, including:

  • Copalum™
  • PicoWire™
  • MicroPax ™
  • AirMax™
  • Meg-Array™

As an inventor, to date, Mr. Lemke has been awarded 55 issued U.S. patents related to interconnection systems, connector designs, cabling, and wire termination